CIRCUIT WIRING BOARD MANUFACTURING METHOD

摘要

The circuit wiring board manufacturing method comprises a step (S1) for forming a polyimide precursor resin layer containing the precursor of a polyimide resin, a step (S2) for impregnating the polyimide precursor resin layer with metal ions, a step (S3) for patterning a resist mask on the surface of the polyimide precursor resin layer, a step (S4) for reducing the metal ions in the polyimide precursor resin layer to form a metal deposition layer, a step (S5) for forming circuit wiring having a pattern by means of plating on said metal deposition layer, and a step (S6) for imidizing the polyimide precursor resin layer using heat treatment toform a polyimide resin layer.