| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily cope with a change in the dimensions of a bump without generating any gaps. <P>SOLUTION: A method for processing a wafer 20 having bumps B formed on a surface 21 includes the steps of: holding on a table 51, a bump region-conforming member 40 that has an outer shape conforming only to a bump region 25 where the bumps are formed in the wafer; forming a resin layer 29 by applying resin around the bump region-conforming member up not less than the thickness of the bump region-conforming member; grinding the bump region-conforming member along with the resin layer to a predetermined thickness; removing the bump region-conforming member from the table to form a recess 45 in the resin layer; applying a film 11 on the surface of the wafer; and disposing the wafer in the recess of the resin layer and holding the wafer on the table so that a backside 22 of the wafer faces upward. After that, the backside of the wafer can also be ground. <P>COPYRIGHT: (C)2009,JPO&INPIT |
