| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet peeling apparatus capable of preventing a peeling tape from adhering to a part except an adhesive sheet attached to a semiconductor wafer, and certainly peeling the adhesive sheet from an adherend. SOLUTION: A sheet peeling apparatus 10 attaches a peeling tape PT at an outer periphery of an adhesive sheet S attached to a semiconductor wafer W, and peels the adhesive sheet from the semiconductor wafer via the peeling tape. The sheet peeling apparatus includes: a holding means 11 including a table 20 for holding the semiconductor wafer; a supporting means 12 supporting the peeling tape; a guide means 13 including a guide plate 27 guiding the peeling tape to a position which faces the adhesive sheet; an adhesive means 14 adhering the peeling tape to the adhesive sheet; and a peeling means 15 peeling the adhesive sheet. The guide plate 27 has a masking means 30 at a front end side thereof. By the masking means, the peeling tape is kept so as not to adhere to a part except the adhesive sheet attached to the semiconductor wafer. COPYRIGHT: (C)2009,JPO&INPIT |
