发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a structure that is easy to manufacture when a microstructure refinement process is advanced. SOLUTION: In a semiconductor device having MOS transistors that have been continuously arranged in the direction of the plane of a substrate, a gate electrode and a wiring section that connects the gate electrodes (part shown by an arrow 13 in the figure) are embedded in a layer lower than the front surface of a substrate 10 where a diffusion layer 14 is formed. On the front surface of the substrate 10, a first element isolation region 12 of an STI structure is formed, which separates diffusion layers 14 that function as a source drain region. On a layer lower than the layer where the first element isolation region 12 exists, a second element isolation region 11 of an STI structure is formed, which separates adjoining MOS transistor channel regions. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009182114(A) 申请公布日期 2009.08.13
申请号 JP20080019162 申请日期 2008.01.30
申请人 ELPIDA MEMORY INC 发明人 UCHIYAMA HIROYUKI
分类号 H01L21/8242;H01L21/3205;H01L21/76;H01L21/768;H01L23/52;H01L27/108;H01L29/423;H01L29/49 主分类号 H01L21/8242
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