| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer substrate in which a polyimide film and an inorganic substrate are stacked, for preventing peeling of the polyimide film, being excellent in productivity. <P>SOLUTION: In the multilayer substrate, the polyimide film is layered on the inorganic substrate with an adhesive in between. The polyimide film contains, as a main component, polyimide that results from reaction between aromatic tetracarboxilic acid and aromatic diamine, with the linear expansion coefficient being≤10 ppm/°C. The 5% weight reduction temperature of the adhesive is≥400°C, with the polyimide or polyimidimide being soluble in organic solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
