| 摘要 |
A substrate for mounting a semiconductor device comprises a first and a second group of input and output terminals and common terminals. The substrate further comprises conductive pads that use for inputting and outputting data from and to the semiconductor device, non-conductive pads that no use for inputting and outputting data from and to the semiconductor device, and common pads formed so as to correspond to the common terminals. The second group of input and output terminals are connected to the non-conductive pads and the common terminals are connected to the common pads when the first group of input and output terminals are connected to the conductive pads, while the first group of input and output terminals are connected to the non-conductive pads and the common terminals are connected to the common pads when the second group of input and output terminals are connected to the conductive pads.
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