COPPER ALLOY MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENTS

摘要

Disclosed is a copper alloy material for electric and electronic components that possesses good bending properties. The copper alloy material has an average grain diameter of 1 to 50 µm wherein the average grain diameter is defined by (a + b)/2 where a represents the thickness of a crystal grain in a section perpendicular to rolling direction; and b represents the width of the crystal grain. The aspect ratio (a/b) of the crystal grain is 0.5 to 1.0. The aspect ratio of the crystal grain before bending, a/b, and the aspect ratio of the crystal grain subjected to tensile stress after 90° bending, a'/b', satisfy the following formula (1). 2 = (a/b)/(a'/b') = 15 Formula (1)