发明名称 MULTILAYER CIRCUIT BOARD, AND MOTOR-DRIVING CIRCUIT BOARD
摘要 <p>Provided is a multilayer circuit substrate having wiring lines arranged to reduce an inductance. A grounded wiring line (22) and a power-source wiring line (33), which are mounted in the multilayer circuit substrate (100), are arranged such that they almost entirely overlap vertically along the longitudinal direction of the board. Electric currents flow in opposite directions at the overlapping portions so that the magnetic fields generated cancel each other. Likewise, a W-phase wiring line (11), a V-phase wiring line (21) and a U-phase wiring line (31) are arranged to overlap partially vertically along the longitudinal direction, so that the magnetic fields to be generated by the electric currents to flow in the vertically overlapping portions cancel each other. Therefore, the inductances of the wiring lines can be decreased by increasing the mutual inductances between those wiring lines.</p>
申请公布号 WO2009099131(A1) 申请公布日期 2009.08.13
申请号 WO2009JP51943 申请日期 2009.02.05
申请人 JTEKT CORPORATION;UCHIDA, NOBUHIRO;NAKAI, MOTOO;SUMASU, HIROSHI 发明人 UCHIDA, NOBUHIRO;NAKAI, MOTOO;SUMASU, HIROSHI
分类号 H05K1/02;B62D5/04 主分类号 H05K1/02
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