| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic package in which a BGA pad has a structure which endures thermal stress applied to its outer peripheral part without providing additional structure such as a reinforcing layer. <P>SOLUTION: The ceramic package 20 includes a ceramic substrate 10, which includes a device mounting surface for mounting a semiconductor device 3 and a ball mounting surface for mounting a plurality of solder balls 24. The ball mounting surface includes a first area on which a ceramic substrate pad electrode 12 with a conductor part exposed is arranged and a second area which is covered with a glass coating film. The ceramic substrate 10 is provided with ceramic substrate pad electrode peripheral wiring covered with the glass coating film in the second area. The thickness of the glass coating film is 10μm or more. The thickness of the ceramic substrate pad electrode 12 and the ceramic substrate pad electrode peripheral wiring is 20μm or more, respectively. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
