| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin molding apparatus which can adjust so that the tension applied to the release film becomes within a fixed range, even when the mold advances or retreats. <P>SOLUTION: A resin encapsulation apparatus is equipped with an upper mold 112 and a lower mold 114 capable of advance and retreat to/from the upper mold 112 and that performs resin encapsulation in the state in which a release film 160 is placed on the surface of the lower mold 114. The apparatus has a supply roll 150 around which the release film 160 before use is wound and a recovery roll 151 which winds the release film 160 after use to recover it arranged to the same side in the horizontal direction to the lower mold 114, is equipped with a plurality of guide rollers 154 to guide the release film 160 from the supply roll 150 to the recovery roll 151 and equipped with a buffer roller 159 capable of adjusting the tension applied to the release film 160 to a fixed range even when the lower mold 114 makes advance or retreat. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
