| 摘要 |
PROBLEM TO BE SOLVED: To provide a micromirror device capable of restraining a gap amount between the first member and the second member from being fluctuated, and capable of securing desired thermal reliability. SOLUTION: This micromirror device 100 has a micromirror chip 110, an electrode substrate 130, a spacer 150, and a solder 170 for joining the micromirror chip 110 to the electrode substrate 130. The spacer 150 has an upper plane 150a face-contacting with the micromirror chip 110, and an under plane 150b face-contacting with the electrode substrate 130, the both are in parallel each other. The spacer 150 has one positioning through-hole 152 for storing a solder 172, and a plurality of through-holes 154, 156, 158 for storing a solder 174. The positioning through-hole 152 restricts the XY-directional moving of the solder 172. The through-holes 154, 156, 158 allow the XY-directional moving of the solder 174. COPYRIGHT: (C)2009,JPO&INPIT
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