CURABLE RESIN COMPOSITION, PREPREG AND COPPER-CLAD LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition giving a cured product having excellent adhesiveness to a copper foil, a low dielectric constant and a dielectric tangent and a high glass transition temperature, and a prepreg and a copper-clad laminate produced by using the composition. SOLUTION: The curable resin composition contains a specific vinyl compound obtained by vinylating terminals of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton in the molecule and a silane compound having a specific structure. COPYRIGHT: (C)2009,JPO&INPIT