SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided are a thin and highly reliable solid-state imaging device which can efficiently dissipate heat, and a method for manufacturing such solid-state imaging device. In the solid-state imaging device, since resin molding is performed to the rear surface of a solid-state imaging element substrate (10) and an uneven shape is arranged on a molded resin (18), a heat dissipating area is increased, temperature increase due to heat generated by the solid-state imaging element substrate (10) is prevented, and malfunction is prevented from being generated.