| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact high-frequency module with high performance while achieving impedance matching between a first filter and a power amplifier. <P>SOLUTION: The high-frequency module 1 comprises a multilayer substrate 10, the power amplifier IC11 mounted on an upper surface of the multilayer substrate 10, and first and second filters 12 and 13 formed in an internal layer of the multilayer substrate 10. The first and the second filters 12 and 13 are disposed substantially right below the power amplifier IC11. Wiring 28 connecting an output terminal of the first filter 12 to an input terminal of the power amplifier IC11 is provided right under the power amplifier IC11 and constituted as a triplate strip line. Consequently, an input terminal of the first filter 12 can be put closer to an input terminal 18 for the high-frequency module 18. Further, impedance matching can be securely achieved between the first filter 12 and power amplifier IC11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
