| 摘要 |
PROBLEM TO BE SOLVED: To prevent characteristics of an electronic circuit including a pair of circuit elements forming a pair from deteriorating owing to mechanical stress of a bump electrode and wiring. SOLUTION: The pair of circuit elements forming a pair of differential amplifiers 210 are disposed in a region on a semiconductor chip 500 except for a region where wiring lines 202 to 205 are formed (including a region where bump electrodes BP3 to BP6 are formed) at a logic part 200. Consequently, mechanical stress due to the wiring lines 202 to 205 and bump electrodes BP3 to BP6 is not applied to those circuit elements. Accordingly, balance of electric characteristics of the pair of circuit elements forming the pair are prevented from being lost owing to the mechanical stress and, in other words, pair characteristics of the pair of circuit elements forming the pair can be improved. COPYRIGHT: (C)2009,JPO&INPIT
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