发明名称 |
PLATING METHOD, PLATED PRODUCT PROVIDED WITH PLATED FILM PRODUCED BY THE PLATING METHOD, AND PLATING SOLUTION |
摘要 |
PROBLEM TO BE SOLVED: To provide a plated gold film having a finely shaped body dispersed therein, by uniformly dispersing the finely shaped body in a plating solution such as a gold plating solution to which a surface active agent cannot be applied. SOLUTION: A plating method employs the plating solution containing the finely shaped body to form a plated film having the finely shaped body dispersed therein, and includes at least: a surface treatment step of forming a carboxyl group on the surface of the finely shaped body; a plating solution preparation step of dispersing the finely shaped body having the carboxyl group formed thereon in the plating solution; and a plating step of forming a plated film having the finely shaped body dispersed therein, by using the plating solution having the finely shaped body dispersed therein. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009179827(A) |
申请公布日期 |
2009.08.13 |
申请号 |
JP20080017801 |
申请日期 |
2008.01.29 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
DEO SHINICHI;YOSHIDA YUKIHISA |
分类号 |
C25D15/02;C25D7/00;H01H11/04;H01H49/00 |
主分类号 |
C25D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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