发明名称 PLATING METHOD, PLATED PRODUCT PROVIDED WITH PLATED FILM PRODUCED BY THE PLATING METHOD, AND PLATING SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide a plated gold film having a finely shaped body dispersed therein, by uniformly dispersing the finely shaped body in a plating solution such as a gold plating solution to which a surface active agent cannot be applied. SOLUTION: A plating method employs the plating solution containing the finely shaped body to form a plated film having the finely shaped body dispersed therein, and includes at least: a surface treatment step of forming a carboxyl group on the surface of the finely shaped body; a plating solution preparation step of dispersing the finely shaped body having the carboxyl group formed thereon in the plating solution; and a plating step of forming a plated film having the finely shaped body dispersed therein, by using the plating solution having the finely shaped body dispersed therein. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009179827(A) 申请公布日期 2009.08.13
申请号 JP20080017801 申请日期 2008.01.29
申请人 MITSUBISHI ELECTRIC CORP 发明人 DEO SHINICHI;YOSHIDA YUKIHISA
分类号 C25D15/02;C25D7/00;H01H11/04;H01H49/00 主分类号 C25D15/02
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