发明名称 |
Method and apparatus for cutting apart a glass substrate, liquid crystal panel, and apparatus for fabricating a liquid crystal panel |
摘要 |
A method for cutting apart a glass substrate is provided whereby scribing of the glass substrate is possible without being affected by the presence or thickness of a deposited film formed thereon and without scratching the deposited film. To treat a glass substrate having a deposited film, such as a thin film or resin film, formed on one surface thereof, there are provided a shaving device, which is a blade that removes strip-shaped portions of the deposited film to expose strip-shaped regions on the glass substrate, and a wheel cutter (14a) that forms scribed lines along the strip-shaped regions exposed on the glass substrate. The glass substrate is cut apart along the scribed lines.
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申请公布号 |
US2009201444(A1) |
申请公布日期 |
2009.08.13 |
申请号 |
US20090320108 |
申请日期 |
2009.01.16 |
申请人 |
YAMABUCHI KOJI;KOMODA TOMOHISA;KAIDA KAZUYA;IZUMI AKINORI;HORIUCHI TAKANE;TAKABE SHINYA;FURUYA TOSHIMITSU;KATAYAMA TETSURO |
发明人 |
YAMABUCHI KOJI;KOMODA TOMOHISA;KAIDA KAZUYA;IZUMI AKINORI;HORIUCHI TAKANE;TAKABE SHINYA;FURUYA TOSHIMITSU;KATAYAMA TETSURO |
分类号 |
G02F1/133;C03B33/033;C03B33/07;C03B33/10;G02F1/1333 |
主分类号 |
G02F1/133 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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