发明名称 Method and apparatus for cutting apart a glass substrate, liquid crystal panel, and apparatus for fabricating a liquid crystal panel
摘要 A method for cutting apart a glass substrate is provided whereby scribing of the glass substrate is possible without being affected by the presence or thickness of a deposited film formed thereon and without scratching the deposited film. To treat a glass substrate having a deposited film, such as a thin film or resin film, formed on one surface thereof, there are provided a shaving device, which is a blade that removes strip-shaped portions of the deposited film to expose strip-shaped regions on the glass substrate, and a wheel cutter (14a) that forms scribed lines along the strip-shaped regions exposed on the glass substrate. The glass substrate is cut apart along the scribed lines.
申请公布号 US2009201444(A1) 申请公布日期 2009.08.13
申请号 US20090320108 申请日期 2009.01.16
申请人 YAMABUCHI KOJI;KOMODA TOMOHISA;KAIDA KAZUYA;IZUMI AKINORI;HORIUCHI TAKANE;TAKABE SHINYA;FURUYA TOSHIMITSU;KATAYAMA TETSURO 发明人 YAMABUCHI KOJI;KOMODA TOMOHISA;KAIDA KAZUYA;IZUMI AKINORI;HORIUCHI TAKANE;TAKABE SHINYA;FURUYA TOSHIMITSU;KATAYAMA TETSURO
分类号 G02F1/133;C03B33/033;C03B33/07;C03B33/10;G02F1/1333 主分类号 G02F1/133
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