METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD

摘要

The invention relates to a method for producing an electronic module. The starting point is a metal conductive foil that is not coated on at least one side. Electronic components are fastened, particularly glued on said foil, wherein the active side faces the foil. The gluing is carried out by the glue being applied only to the points where the electronic components are to be fastened. The glue can either be applied to the foil or to the electronic components. The components are then pressed against the foil and are glued therewith. Then the foil comprising the glued-on components is laminated on the side of the components with a circuit board carrier. Only then is a circuit board structure created on the opposite side and only then are the connections of the electronic components contacted through the conductive foil. For contacting, further levels can be applied to the structured, conductive foil.