THERMODE DEVICE

摘要

The invention relates to a thermode device for connecting electronic components, particularly semiconductor components, to a substrate (11) by applying pressure and temperature, comprising two plungers (3, 5), wherein at least one thereof is fastened to a carrier arm (2) designed as pivoting arm that can be moved in a tongs-like manner and which can be moved by a pivoting movement of the pivoting arm relative to the opposite plunger (5).