发明名称 METHOD FOR MANUFACTURING PIEZOELECTRIC OSCILLATION DEVICE, AND PIEZOELECTRIC OSCILLATION DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric oscillation device which prevents a joining failure due to metal film adherence at the time of frequency adjustment so as to enable fine joining of an piezoelectric oscillation piece to an enclosure, and to provide a piezoelectric oscillation device. <P>SOLUTION: In a piezoelectric oscillation piece assembly made by integrating a plurality of tuning fork type piezoelectric oscillation pieces 4, a pair of junction portions 7 is formed on the front and back surfaces of a base 51 of each piezoelectric oscillation piece 4, respectively. The manufacturing method for the piezoelectric oscillation piece assembly includes: an electrode forming step of forming a plurality of electrodes on each piezoelectric oscillation piece 4; an adjusting film forming step of forming adjusting metal films 43 and 44 on the outer peripheral surfaces of the end areas of a pair of arms 41 and 42; a frequency adjusting step of emitting a laser beam onto the adjusting metal films 43 and 44 to carry out frequency adjustment; and a joining step of separating each piezoelectric oscillation piece 4 from the piezoelectric oscillation piece assembly and then joining junction portions 7c and 7d on the back main surface thereof to the interior of the enclosure. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009182873(A) 申请公布日期 2009.08.13
申请号 JP20080021885 申请日期 2008.01.31
申请人 DAISHINKU CORP 发明人 FUJII SATOSHI
分类号 H03H3/04;H01L41/09;H01L41/18;H01L41/22;H01L41/253;H01L41/313;H01L41/338;H03H3/02;H03H9/10 主分类号 H03H3/04
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