| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board which is improved in a heat dissipation property while excellently keeping the connection to an electronic component. SOLUTION: On the almost center part of one surface of an insulating layer 1, a mounting region S is provided. A conductor pattern 2 is formed so as to extend from the inner side of the mounting region S to the outer side. Around the mounting region S, a cover insulating layer 4 is formed so as to cover the conductor pattern 2. The terminal part 21 of the conductor pattern 2 is disposed on the mounting region S, and the bump of the electronic component 5 is bonded to the terminal part 21. On the other surface of the insulating layer 1, a metal layer 3 composed of copper, for instance, is provided. On the metal layer 3, a pair of slits 3a is formed so as to clamp a region facing the electronic component 5. The respective slits 3a are formed so as not to divide the metal layer 3 into a plurality of regions. COPYRIGHT: (C)2009,JPO&INPIT
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