| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solder crack due to thermal stress of a signal bump 113 by arranging dummy bumps 105-112, in a module board 11 with solder bumps arranged in a grid array-like form. SOLUTION: Dummy bump groups 105-112 divided into 8 groups are arranged in the outer periphery of a signal bump 113 group, arranged on a rectangular module board 11; the dummy bump groups 109-112 on one-side two sides are arranged, coincidence with the bump center of the signal bump group 113; and the bumps of the dummy bump groups 105-108 on the other-side two sides are arranged in intermediate parts, between the one-side two side dummy bump groups 109-112 and the signal bump group 113. COPYRIGHT: (C)2009,JPO&INPIT
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