发明名称 Light Emitting Device Mounting Substrate, Light Emitting Device Housing Package, Light Emitting Apparatus, and Illuminating Apparatus
摘要 A light-emitting apparatus with improved dissipation efficiency of heat transmitted to a specific electrode of a light-emitting device is provided. A light-emitting device mounting substrate used for the light emitting apparatus include a base body (1) which mounts thereon a light-emitting device (3); a first electrically conductive path (L1) formed within the base body (1), one end thereof being electrically connected to a first electrode (3a) of the light-emitting device (3) and the other end thereof being led out to a surface of the base body (1); and a second electrically conductive path (L2) formed in the base body (1), one end thereof being electrically connected to a second electrode (3b) of the light-emitting device (3), and the other end thereof being formed on the surface of the base body (1). The first electrically conductive path (L1) is made smaller in thermal resistance than the second electrically conductive path (L2).
申请公布号 US2009200570(A1) 申请公布日期 2009.08.13
申请号 US20050718217 申请日期 2005.10.27
申请人 KYOCERA CORPORATION 发明人 MORI YUKI;SEKINE FUMIAKI
分类号 H01L33/62;H01L33/64 主分类号 H01L33/62
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