| 摘要 |
The present invention relates to heat transfer apparatus (1) for mounting on a vessel (5). The apparatus (1) comprises at least first and second sets of substantially planar fins (7,9). The fins (7) in the first set are angularly offset from and interconnect with the fins (9) in the second set. A plurality of the fins (7,9) is profiled to conform to the shape of the corresponding surface of the vessel (5). |
