DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING SAME, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME, AND PORTABLE DEVICE

摘要

PROBLEM TO BE SOLVED: To improve connection reliability between a projection structure and an electrode of a semiconductor device by a structure connecting the projection structure and the electrode of the semiconductor device.

SOLUTION: An device mounting board 10 has an insulating resin layer 12, a wiring layer 14 provided on one main surface of the insulating resin layer 12, and a bump electrode 16 which is electrically connected to the wiring layer 14 and projects from the wiring layer 14 toward the insulating resin layer 12. Unevenness is formed on a side surface of the bump electrode 16, and the side surface is larger in surface roughness than a surface of the bump electrode 16.

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