| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic multilayer substrate having an excellent de-binder property, inhibiting the projection of a via-hole conductor from a substrate surface and having a high dimensional accuracy. <P>SOLUTION: The method includes a process in which un-sintered first constraint layers 31 starting no burning-shrinkage at the burning-shrinkage end temperature of a ceramic green-sheet laminate 1 and having a thickness of 5 to 70μm and un-sintered second constraint layers 32 completing the burning shrinkage before the start of the burning shrinkage of the ceramic green-sheet laminate 1 after the de-binder of the ceramic green-sheet laminate 1 are laminated in the order and a composite laminate 5 is manufactured on an outermost ceramic green-sheet having through-holes 21 filled with paste 22 for the via-hole conductor. The composite laminate 5 is baked at a temperature sintering the second constraint layers 32 and the ceramic green-sheet laminate 1 and sintering no first constraint layers 31. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
