| 摘要 |
PROBLEM TO BE SOLVED: To provide a piezoelectric component which can be miniaturized and whose cost is reduced, and a method of manufacturing the same. SOLUTION: A piezoelectric element 2 having a vibration part consisting of an IDT 2a formed on a piezoelectric substrate 2f and element wiring connected to the IDT 2a is provided. The piezoelectric element 2 and a joint substrate 1 are adhered to each other by a bump 3 and an insulating resin frame 4 so as to face the IDT 2a. The joint substrate 1 includes joint substrate wiring 1b on one main surface opposite to the IDT 2a, an external terminal 5 on the other main surface, and a through-hole 1a on a joint substrate edge, respectively. The bump 3 and the joint substrate wiring 1b of the joint substrate 1 are electrically connected to each other. The joint substrate wiring 1b and the external terminal 5 are electrically connected to each other via the through-hole 1a. COPYRIGHT: (C)2009,JPO&INPIT |
