| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method of an electronic component to a terminal fitting, capable of preventing solder from adhering to the terminal fitting in an icicle-like form, preventing diffusion of flux into a molten solder bath, and preventing a liquid surface of molten solder from contacting an unintended part. SOLUTION: In an immersion process, a lower end 53B of the terminal fitting 53 is brought close to the liquid surface of the molten solder 2 and immersed therein without being vibrated, while the lower end 53B of the terminal fitting 53 is kept arranged opposite to the liquid surface. In a vibration start process, vibration of a quasi-coil component 50 is started with a predetermined amount of the lower end 53B of the terminal fitting 53 immersed in the molten solder bath. In a lifting process, the lower end 53B of the terminal fitting 53 is lifted from the molten solder 2 in the molten solder bath, while the vibration is continued, in the same conditions as those of the vibration in the vibration start process, and the lower end 53B of the terminal fitting 53 is separated from the liquid surface of the molten solder bath. COPYRIGHT: (C)2009,JPO&INPIT
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