发明名称 |
HEATPLATES FOR HEATSINK ATTACHMENT FOR SEMICONDUCTOR CHIPS |
摘要 |
An apparatus for heatsink attachment and a method for forming the apparatus. The apparatus includes a substrate, a semiconductor chip on top of and physically attached to the substrate, and a lid on top of the substrate. The lid includes a first thermally conductive material. The apparatus further includes a heatsink on top of the lid. The heatsink includes a second thermally conductive material. The semiconductor chip and the substrate share a common interface surface that defines a reference direction perpendicular to the common interface surface and pointing from the substrate towards the semiconductor chip. The lid is disposed between the substrate and the heatsink. The lid includes a first protruding member. The first protruding member of the lid is farther away from the substrate than a portion of the heatsink in the reference direction.
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申请公布号 |
US2009200660(A1) |
申请公布日期 |
2009.08.13 |
申请号 |
US20090393346 |
申请日期 |
2009.02.26 |
申请人 |
AWAD ELIE;MALONEY JOHN JAY |
发明人 |
AWAD ELIE;MALONEY JOHN JAY |
分类号 |
H01L23/04;H01L21/50;H01L23/34 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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