发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME |
摘要 |
The present invention relates to semiconductor devices comprising two or more dies stacked vertically on top of one another, and methods of making the semiconductor devices. The methods may comprise a combination of wafer-level through silicon interconnect fabrication and wafer-level assembly processes.
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申请公布号 |
US2009200662(A1) |
申请公布日期 |
2009.08.13 |
申请号 |
US20090369429 |
申请日期 |
2009.02.11 |
申请人 |
UNITED TEST AND ASSEMBLY CENTER LTD |
发明人 |
NG CATHERINE BEE LIANG;TOH CHIH HOCK;SUN ANTHONY YI-SHENG |
分类号 |
H01L23/28;H01L21/77 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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