ELECTRONIC COMPONENT PICKUP METHOD, ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING APPARATUS

摘要

This invention intends to provide an electronic component pick-up method, an electronic component loading method and an electronic component loading apparatus which are capable of executing a pick-up operation of an electronic component adhesively held on a carrier stably and with high productivity. In an electronic component pick-up method for picking up a chip 6 adhesively held by an adhesive layer 5a on a sheet 5, as the adhesive layer 5a, an adhesive containing a compound generating a nitrogen gas by application of ultraviolet rays is employed. In the pick-up operation, with a light applying unit 8 being located beneath the chip 6 to be picked up, ultraviolet rays is applied to the adhesive layer 5a located on the rear side of the chip 6 from the lower side of the sheet 5, and the chip 6 is picked up by bringing the holding tool 20 into contact with the upper surface of the chip 6 in a state where the nitrogen gas generated from the adhesive layer 5a has created a gaseous layer G between a bonding boundary between the rear surface of the chip 6 and the adhesive layer 5a.