发明名称 TRI-GATE DEVICES AND METHODS OF FABRICATION
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device comprising a semiconductor body having a top surface sidewalls on both right and left sides formed on a substrate, and its fabrication method. SOLUTION: A gate dielectric layer is formed on the top surface of the semiconductor body and on the sidewalls on both right and left sides of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and is formed adjacently to the gate dielectric on the sidewalls on both the right and left sides of the semiconductor body. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009182360(A) 申请公布日期 2009.08.13
申请号 JP20090122283 申请日期 2009.05.20
申请人 INTEL CORP 发明人 CHAU ROBERT;DOYLE BRIAN;KAVALIEROS JACK;BARLAGE DOUGLAS;DATTA SUMAN
分类号 H01L29/786;H01L21/336;H01L29/423;H01L29/78 主分类号 H01L29/786
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