发明名称 |
TRI-GATE DEVICES AND METHODS OF FABRICATION |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device comprising a semiconductor body having a top surface sidewalls on both right and left sides formed on a substrate, and its fabrication method. SOLUTION: A gate dielectric layer is formed on the top surface of the semiconductor body and on the sidewalls on both right and left sides of the semiconductor body. A gate electrode is formed on the gate dielectric on the top surface of the semiconductor body and is formed adjacently to the gate dielectric on the sidewalls on both the right and left sides of the semiconductor body. COPYRIGHT: (C)2009,JPO&INPIT
|
申请公布号 |
JP2009182360(A) |
申请公布日期 |
2009.08.13 |
申请号 |
JP20090122283 |
申请日期 |
2009.05.20 |
申请人 |
INTEL CORP |
发明人 |
CHAU ROBERT;DOYLE BRIAN;KAVALIEROS JACK;BARLAGE DOUGLAS;DATTA SUMAN |
分类号 |
H01L29/786;H01L21/336;H01L29/423;H01L29/78 |
主分类号 |
H01L29/786 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|