| 摘要 |
PROBLEM TO BE SOLVED: To provide a component cooling structure capable of cooling an electronic component by efficiently utilizing the entire cooling medium while reducing the pressure loss of the cooling medium flowing through a cooling medium flow path. SOLUTION: The component cooling structure 1 is composed by closely arranging the electronic component 2 and a cooling pipe 3 for distributing the cooling medium 5 for cooling the electronic component 2 in the inside. The cooling pipe 3 partially has a narrowed part 4 where the flow path width of the cooling medium flow path 31 is narrowed in a flow path width direction Z orthogonal to the distributing direction X of the cooling medium 5 and a laminating direction with the electronic component 2. COPYRIGHT: (C)2009,JPO&INPIT
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