发明名称 |
THERMALLY CONDUCTIVE POWDER COATING COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive powder coating composition for applying a thermally conductive powder coating to a casing body of an electronic apparatus having a complicated shape to form a coating film having characteristics for coping with heat on the electronic apparatus in addition to conventional anti-corrosiveness. SOLUTION: The thermally conductive powder coating composition is obtained by blending 100 pts.wt. of a resin component and 20-900 pts.wt. of a thermally conductive material including a specific pitch-based carbon short fiber filler formed of mesophase pitch. The thermally conductive powder coating composition gives an excellently thermally conductive coating film having thermal conductivity of 3 W/(m×K) or more. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009179700(A) |
申请公布日期 |
2009.08.13 |
申请号 |
JP20080019109 |
申请日期 |
2008.01.30 |
申请人 |
TEIJIN LTD |
发明人 |
HARA HIROSHI;SANO HIROKI;KIN TATSUICHIRO |
分类号 |
C09D201/00;C09D5/03;C09D7/12;C09D123/00;C09D161/04;C09D163/00;C09D167/00;C09D175/04;C09D177/00 |
主分类号 |
C09D201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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