发明名称 |
Forming Compliant Contact Pads For Semiconductor Packages |
摘要 |
In one embodiment, the present invention includes a semiconductor package having a substrate with a first surface to support a semiconductor die. A second surface of the substrate includes compliant conductive pads to provide electrical connections to the semiconductor die. In this way, improved connection between the semiconductor package and a socket is provided. Other embodiments are described and claimed.
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申请公布号 |
US2009200681(A1) |
申请公布日期 |
2009.08.13 |
申请号 |
US20090426322 |
申请日期 |
2009.04.20 |
申请人 |
ZHOU QING;SHI WEI;LU DAOQIANG;HE JIANGQI |
发明人 |
ZHOU QING;SHI WEI;LU DAOQIANG;HE JIANGQI |
分类号 |
H01L23/492 |
主分类号 |
H01L23/492 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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