发明名称 THERMOSETTING CONDUCTIVE PASTE AND LAMINATED CERAMIC ELECTRONIC COMPONENT POSSESSING EXTERNAL ELECTRODES FORMED USING SAME.
摘要 <p>Provided is a thermosetting conductive paste, and a laminated ceramic electronic component possessing external electrodes formed using same, which resolve the problem with thermosetting conductive paste of bonding between internal and external electrodes, and with which it is thus possible to provide satisfactory electrical characteristics (tand) and high reliability (heat cycle durability, moisture resistance), and to form external electrodes that are well suited to plating. The thermosetting conductive paste contains (A) 45 to 85 parts by weight silver powder with a mean grain size of 0. 2 to 30 µm, (B) 5 to 35 parts by weight tin-silver alloy powder with a mean grain size of 0. 2 to 15 µm, (C) 5 to 25 parts by weight silver and/or silver-tin alloy fine powder with a mean grain size of 15 to 150 nm, and (D) 6 to 18 parts by weight thermosetting resin, wherein the total of ingredient (A), ingredient (B), and ingredient (C) is 100 parts by weight.</p>
申请公布号 WO2009098938(A1) 申请公布日期 2009.08.13
申请号 WO2009JP50839 申请日期 2009.01.21
申请人 NAMICS CORPORATION;IKARASHI, SENICHI;SUGATA, HIRONORI 发明人 IKARASHI, SENICHI;SUGATA, HIRONORI
分类号 H01B1/22;H01C7/04;H01C7/10;H01G4/12;H01G4/252;H01G4/30 主分类号 H01B1/22
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