| 摘要 |
<p>A submount (1, 21) for an optoelectronic device (41) includes a substrate, a first top pad (7, 9) on a top surface (5) of the substrate, a first bottom pad (15, 17) on a bottom surface (19) of the substrate and a first wrap-around contact (13) in a sidewall recess (11, 12) of the substrate, in which the first wrap-around contact (13) is coupled electrically to the first top pad (7, 9) and to the first bottom pad (15, 17). Alternatively, or in addition, the submount (21) includes a device mounting pad (27) on the top surface (25) of the substrate, a wire -bond pad (9, 29) on the top surface (5, 25) of the substrate, a contact pad (15, 17, 33, 35) on the bottom surface (19, 39) of the substrate and a feedthrough contact (31) which extends through the substrate and electrically couples the wire -bond pad (9, 29) to the contact pad (15, 35).</p> |
