发明名称 WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board formed with a wiring conductor configuring on the surface a transmission path whose transmission delay is prevented, and characterized by preventing the deterioration of insulating property, the increase of a dielectric loss and the change of a color, and to provide a method of manufacturing the wiring board. <P>SOLUTION: The wiring board includes: an insulating substrate 1 configured of a plurality of glass ceramic insulating layers including first glass ceramic insulating layers 11a and 11e and second glass ceramic insulating layers 12a and 12d brought into contact with the insides of the first glass ceramic insulating layers 11a and 11e, and configured to start burning contraction at a temperature which is lower than the burning contraction start temperature of the first glass ceramic insulating layers 11a and 11e; and a surface wiring conductor 2a with Ag formed on the surface of the insulating substrate 1 as main components, wherein the carbon content of the insulating substrate 1 is equal to or less than 0.01 mass%, and a plurality of voids are unevenly distributed in a neighboring region A of the surface wiring conductor 2a in the first glass ceramic insulating layers 11a and 11e. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009182285(A) 申请公布日期 2009.08.13
申请号 JP20080022304 申请日期 2008.02.01
申请人 KYOCERA CORP 发明人 KAWAI SHINYA
分类号 H05K3/46 主分类号 H05K3/46
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