发明名称 HEAT RADIATION DEVICE FOR ELECTRONIC UNIT
摘要 PROBLEM TO BE SOLVED: To improve heat radiation efficiency by accelerating the flow of air sucked by a fan and blowing it to a fin, with respect to an electronic unit provided with the fin for radiating the heat of a chassis. SOLUTION: In the heat radiation device of the electronic unit configured to radiate the heat generated in an electronic component disposed to the chassis by making a gas sucked by a suction fan pass through a ventilation path formed on the chassis. A plurality of planar fins are arranged along the distributing direction of the gas in the ventilation path, and by making at least one planar fin being arranged meanderly, the part of a wide spacing between adjacent planar fins and the part of a narrow spacing are formed along the gas distributing direction, and at least some of the sucked gas flows from the wide spacing part formed between the adjacent planar fins to the narrow part at least once. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009182215(A) 申请公布日期 2009.08.13
申请号 JP20080021033 申请日期 2008.01.31
申请人 ICOM INC 发明人 SAKANO YOSHIKAZU
分类号 H05K7/20 主分类号 H05K7/20
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