| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip coil having an improved humidity resistance and a high space factor, and a method for manufacturing the same. SOLUTION: The chip coil is composed of an element body made of a cured resin material having a water absorption of 0.8% or less, a coil pattern having a via connection arranged in the element body, and electrodes provided on the surface of the element body. Thereby, the chip coil having an excellent humidity resistance can be obtained while a high space factor of the coil pattern is assured. COPYRIGHT: (C)2009,JPO&INPIT
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