发明名称 |
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD |
摘要 |
A semiconductor device (2) includes: a (65) that is disposed on a field limiting ring (FLR) semiconductor substrate so as to divide the semiconductor substrate into an inner region and an outer region; a first bonding pad (24a to 24d) that is disposed in the inner region and is connected to an external circuit by a wire (14a to 14d) whose one end is connected to the external circuit; and a second bonding pad (26a to 26d) that is disposed in the outer region and on which the other end of the wire is bonded. |
申请公布号 |
WO2009034461(A3) |
申请公布日期 |
2009.08.13 |
申请号 |
WO2008IB02379 |
申请日期 |
2008.09.12 |
申请人 |
TOYOTA JIDOSHA KABUSHIKI KAISHA;TANAKA, HIROAKI |
发明人 |
TANAKA, HIROAKI |
分类号 |
H01L23/485;H01L21/60;H01L29/06;H01L29/739 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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