AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD

摘要

Disclosed is an aqueous dispersion for chemical mechanical polishing, which contains silica particles (A) and an organic acid (B1). The silica particles have such chemical properties that the sodium, potassium and ammonium ion contents determined by the elemental analysis by ICP emission spectrometry or ICP mass spectrometry and the quantitative analysis of ammonium ions by ion chromatography are as follows: the sodium content is within the range of 5-500 ppm; and the content of at least one of potassium and ammonium ions is within the range of 100-20,000 ppm.