| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition excellent particularly in electroconductivity, and to provide, using the resin composition, a circuit board having a conductor circuit exhibiting excellent electroconductivity and a semiconductor device having formed an adhesive layer exhibiting excellent electroconductivity. <P>SOLUTION: The resin composition comprises an electroconductive particle, an organic binder and a compound bearing a sulfide bond and a hydroxy group. The electroconductive device and the circuit board each manufactured using the resin composition exhibit excellent electroconductivity. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
