| 摘要 |
PROBLEM TO BE SOLVED: To provide a micro electromechanical device which prevents a damage of a sealing layer and is excellent in reliability. SOLUTION: The micro electromechanical device is provided with: a MEMS element 3 formed on a semiconductor substrate 2; a cavity forming film 4 for covering the MEMS element 3 to provide a cavity 9 between the element 3 and itself and having a through-hole 10 formed on part of its upper surface; the sealing layer 5 for stopping up the through-hole 10 of the film 4 to seal the MEMS element 3 within the cavity 9; a protective layer 6 for covering the sealing layer 5 to provide a cavity 11 between the layer 5 and itself; and a connecting member 12 for connecting the protective layer 6 with the semiconductor substrate 2. The connecting member 12 is made of synthetic resin with the permeability larger than that of a composition material of the protective layer 6. COPYRIGHT: (C)2009,JPO&INPIT
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