| 摘要 |
A test head, system and method allowing functional wafer level testing of a test wafer, a die under test or a wafer under test, including at least one chip. The test head includes a semiconductor wafer and a series of protrusions in the semiconductor wafer. Each protrusion of the series of protrusions includes an electrical interconnection on a bottom surface of the semiconductor wafer, and a corresponding probe tip protruding from a top surface of the semiconductor wafer for establishing an electrical connection with a solder bump of the test wafer. The series of protrusion probe tips includes a pitch range of about 1 mum to about 100 mum.
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