METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE

摘要

This object aims to provide a method for manufacturing an electronic component device, in which a chip component is mounted on a wiring board, with high productivity and stabilized quality and at a reduced cost. For the purpose, paste (1) of metal nano-particles is applied onto a substrate side electrode (23), a load (30) is applied in such a state that a wiring board (22) is aligned with a chip component (26), whereby compression deforming of the paste (1) of metal nano-particles is performed until the paste becomes a compressive deformation limit thickness (31). Thereafter, the paste (1) of metal nano-particles is so heated as to obtain a bonding sintered body (6) made of sintered metal nano-particles, thereby mutually bonding the substrate side electrode (23) and a chip side electrode (27).