| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer base for forming a multilayer printed wiring board, along with a manufacturing method of a multilayer printed wiring board using the same, wherein a buried via hole of very small aperture is easily and precisely formed with no dislocation, for obtaining a multilayer printed wiring board of high productivity and reliability. <P>SOLUTION: A multilayer base 15 for forming a multilayer printed wiring board comprises a through-hole 12 which is to be a buried via hole 4 positioned on a copper circuit, on an outer layer base or on an inner layer base 2 having a copper circuit 3 on a surface layer, with a prepreg layer arranged wherein the through-hole is filled with a conductive connection material or conductive connection body. The prepreg layer is in a half-cured state, being temporarily jointed to the surface of the outer layer base or the inner layer base, with the conductive connection material or conductive connection body being contacted to the copper circuit. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
