发明名称 |
HOUSING, METHOD OF MANUFACTURING HOUSING, AND ELECTRONIC APPARATUS USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a housing which has a simple structure, a small volume and an antenna installed inside, and to provide a method of manufacturing the housing and an electronic device using the same. SOLUTION: The housing includes a thin film layer, a substrate layer, and an antenna. The substrate layer is connected with the film layer by injection molding. The antenna is a conductive ink coating formed on the film layer. The film layer includes a first surface and a second surface opposite each other. On the second surface, an antenna connecting part is formed, and the antenna is formed at the antenna connecting part. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009182962(A) |
申请公布日期 |
2009.08.13 |
申请号 |
JP20090008213 |
申请日期 |
2009.01.16 |
申请人 |
SHENZHEN FUTAIHONG PRECISION INDUSTRIAL CO LTD;SUTECH TRADING LTD |
发明人 |
YANG FU-KENG;CHO HEI;ZENG YI-PING;ZHAN JIAN-JUN |
分类号 |
H01Q1/38;H01Q1/24;H01Q1/42;H05K1/16;H05K3/00;H05K3/12;H05K3/28 |
主分类号 |
H01Q1/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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