Method of forming an electronic device on a substrate supported by a carrier and resultant device

摘要

A method for forming an electronic device on a flexible substrate conditions the surface of a carrier to form a holding area for retaining the flexible substrate. A contact surface of the flexible substrate is applied against the carrier with an intermediate binding material applied between at least the holding area of the carrier and the corresponding area of the contact surface. Entrapped gas between the flexible substrate and the carrier is removed and the substrate processed to form the electronic device thereon. The substrate can then be removed from the holding area to yield the resultant electronic device.