| 摘要 |
<p>The present invention relates to a method for cutting solar cell single crystal silicon ingots, and to a method for cutting mass-produced round rod-shaped solar cell single crystal silicon ingots into square-shaped ingots prior to an ingot slicing process for manufacturing wafers. The method of the present invention automatically and precisely cuts a plurality of rod-shaped ingots into square-shaped ingots at one time, thereby improving workability.</p> |
